Jump to content

Search the Community

Showing results for tags 'nand'.

  • Search By Tags

    Type tags separated by commas.
  • Search By Author

Content Type


Forums

  • General
    • General Discussion
    • Artificial Intelligence
    • DevOpsForum News
  • DevOps & SRE
    • DevOps & SRE General Discussion
    • Databases, Data Engineering & Data Science
    • Development & Programming
    • CI/CD, GitOps, Orchestration & Scheduling
    • Docker, Containers, Microservices, Serverless & Virtualization
    • Infrastructure-as-Code
    • Kubernetes & Container Orchestration
    • Linux
    • Logging, Monitoring & Observability
    • Security, Governance, Risk & Compliance
  • Cloud Providers
    • Amazon Web Services
    • Google Cloud Platform
    • Microsoft Azure

Find results in...

Find results that contain...


Date Created

  • Start

    End


Last Updated

  • Start

    End


Filter by number of...

Joined

  • Start

    End


Group


Website URL


LinkedIn Profile URL


About Me


Cloud Platforms


Cloud Experience


Development Experience


Current Role


Skills


Certifications


Favourite Tools


Interests

Found 5 results

  1. NAND-based storage devices are a fiercely contested sector, one in which Samsung has held the lead since 2002, but its rivals are gaining ground. The South Korean electronics giant has announced plans to commence mass production of its newest 290-layer ninth-generation vertical (V9) NAND chips, aimed at AI and cloud devices as well as large-scale enterprise servers. These utilize Samsung’s double-stack technology, rather than the triple stack method typically used. Other firms are closing in, however. SK Hynix, the world's second-largest memory chipmaker and Samsung’s archrival, intends to launch its 321-layer NAND tech early next year, while Chinese flash memory specialist Yangtze Memory Technologies says it plans to introduce 300-layer chips later this year. A game of chicken With the battle heating up, Samsung is already looking beyond the impending V9 launch, with industry insiders indicating that a staggering 430-layer tenth-generation (V10) NAND chip is expected to be unveiled next year. Unlike the V9, this will use Samsung’s triple-stack technology. The aggressive push for NAND supremacy comes as demand for high-performance and large-capacity storage devices grows in the AI era. High-density NAND chips answer that demand while also enhancing capabilities for 5G smartphones. The Korea Economic Daily says the major chipmakers are now “engaged in a game of chicken in a race to develop advanced chip stacking technology to cut costs and improve performance.” It points out that Samsung has previously announced plans to develop over 1,000-layer NAND chips by 2030. More from TechRadar Pro Scientists inch closer to holy grail of memory breakthroughSamsung to showcase record-smashing 280-layer QLC NAND flash memory chipHere’s the chip that could make 100TB SSDs mainstream in 2024 View the full article
  2. Samsung's next-generation 290-layer 3D NAND will use string stacking, says report. View the full article
  3. Western Digital messaged partners to inform them of supply constraints and rising prices amidst tumultuous industry conditions. Prices could increase by 10% for HDDs, more for NAND. View the full article
  4. Kioxia expects 1,000-layer 3D NAND memory in six or seven years using innovative production methods. View the full article
  5. There will be further double-digit NAND flash contract price increases in Q2 2024, says an industry analyst report. Client SSDs could climb up 15% before the quarter is over. View the full article
  • Forum Statistics

    43.6k
    Total Topics
    43.2k
    Total Posts
×
×
  • Create New...